Opportunities and Challenges for Next-Generation Semiconductor　Technology in Taiwan

Coupled with the rapid growth in various fields of information technology around the world, such as 5G, artificial intelligence (AI), the Internet of Everything (IoE), industrial automation, and autonomous driving technologies, the demand for chips and various electronic components has rapidly risen. These chips and electronic components rely on IC design and semiconductor technology. After years of hard work puts Taiwan at an advantage with its established and comprehensive supply chain in the semiconductor industry. Not only is it a significant part of its domestic index, but it also plays a key role in its international trade industry. Articles in the Outstanding Laboratory column in April will feature semiconductor materials, advanced processing solutions, and derivative applications including renewable energy, AIoT, electrical vehicle (EV) components, biomedical sensor components, defense, and wireless communications. Looking to the future to ensure Taiwan’s continued competitiveness in the global semiconductor industry, the technology industry must form a cross-disciplinary research team and effectively integrate research talents covering physics, chemistry, materials, microelectronics, and instrument technology to develop commercially competitive and new advanced material components as well as related manufacturing technologies.

Kenneth Tai

The Leader of Smart and Green Life-Compound Semiconductors

Jia-Yeh Wang

Digital Optics – Silicon-Based Heterogeneous Integration Opens The Gate for Digital Optics and Innovation

Edward Yi Chang

The Rise and Shine of III-V Compound Semiconductors – Evolution of 5G and Sub 6G Communication

Yi-Keng Fu

Guarding our health with light: a discussion of the application of deep ultraviolet light-emitting diodes on microorganism disinfection

Chen-Fu Chien

Advanced Quality/Process/Equipment Control for Semiconductor Smart Manufacturing

Kung-Yen Lee

The Third Generation Semiconductors: The Rise of SiC Power Semiconductor Devices

Shih-Hsiang Hsu

Windowed Fourier Transform Biosensing through Fano Resonance to Enhance Sensitivity

Tung-Ying Hsieh

Facing the challenges of the post-Moore era: three-dimensional integrated circuits